A 1,000x improvement in computer systems by bridging the processor-memory gap

For over 4 decades the gap between computer processing speed and memory access has grown at about 50% per year, to more than 1,000x today. This provides an excellent opportunity to enhance the single-core system performance. An innovative 3D integration technology combined with re-architecting the i...

Full description

Saved in:
Bibliographic Details
Published in2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) pp. 1 - 4
Main Author Or-Bach, Zvi
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.10.2017
Subjects
3D memory
Computer architecture
Micrometers
processor-memory gap
Silicon
Silicon germanium
Substrates
Three-dimensional displays
Through-silicon vias
Online AccessGet full text

Cover

More Information
Summary:For over 4 decades the gap between computer processing speed and memory access has grown at about 50% per year, to more than 1,000x today. This provides an excellent opportunity to enhance the single-core system performance. An innovative 3D integration technology combined with re-architecting the integrated memory device is proposed to bridge the gap and enable a 1,000 x improvement in computer systems. The proposed technology utilizes processes that are widely available and could be integrated in products within a very short time.
DOI:10.1109/S3S.2017.8309202