Reliability and new failure modes of encapsulated flip chip on board under thermal shock testing

The thermomechanical reliability of flip chip on board (FCOB) assembly under thermal shock test is addressed in this paper by investigation of different material/process combinations (underfill, flux, reflow atmospheres). It is verified that solder fatigue is the dominate failure mechanism and delam...

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Bibliographic Details
Published inFifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003 pp. 416 - 421
Main Authors Cheng Bo, Wang Li, Zhang Qun, Gao Xia, Xie Xiaoming, Kempe, W.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2003
Subjects
Assembly
Atmosphere
Electric shock
Failure analysis
Fatigue
Flip chip
Materials reliability
Materials testing
Soldering
Thermomechanical processes
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Summary:The thermomechanical reliability of flip chip on board (FCOB) assembly under thermal shock test is addressed in this paper by investigation of different material/process combinations (underfill, flux, reflow atmospheres). It is verified that solder fatigue is the dominate failure mechanism and delamination has obvious adverse effect on the solder joint lifetime. Periodic solder joint crack is first reported in this study and is determined to be related to glass fiber distribution in the PCB.
ISBN:0780381688
9780780381681
DOI:10.1109/EPTC.2003.1298772