Automated structure function object mapping

Imposing a step change in power dissipation to a packaged semiconductor and measurement of the resulting thermal response of a temperature sensitive parameter in time is a well-established testing method. This thermal response can be processed so as to derive a structure function, a representation o...

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Bibliographic Details
Published in2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) pp. 114 - 118
Main Authors Blackmore, Byron, Bornoff, Robin, Proulx, Joe, Vass-Varnai, Andras
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.03.2018
Subjects
JESD 51-14
Structure Function
TDIM
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Summary:Imposing a step change in power dissipation to a packaged semiconductor and measurement of the resulting thermal response of a temperature sensitive parameter in time is a well-established testing method. This thermal response can be processed so as to derive a structure function, a representation of the thermal resistances and thermal capacitances the heat experiences as it travels from source to ambient. Identification of the objects through which the heat passes can be inferred by visual inspection of the changing gradients of the structure function. The thermal resistance and capacitance of those objects can thus be observed. Such visual inspection requires some level of experience. This study presents an automated approach to map the objects in the heat flow path to sections of the structure function utilizing a 3D thermal simulation of the measured device under test.
ISSN:2577-1000
DOI:10.1109/SEMI-THERM.2018.8357361