A seebeck coefficient extraction methodology for thin film thermoelectric devices with different substrates

Based on our previous works, this paper proposes a new measurement methodology to extract the Seebeck coefficients for single layer, thin-film thermoelectric devices developed on different flexible substrates. With the new sandwich-like apparatus design, a stably controlled temperature gradient envi...

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Bibliographic Details
Published in2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) pp. 286 - 289
Main Authors Yao-Shing Chen, Ben-Je Lwo
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.10.2017
Subjects
Pressure measurement
Probes
Silver
Substrates
Temperature control
Temperature measurement
Testing
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Summary:Based on our previous works, this paper proposes a new measurement methodology to extract the Seebeck coefficients for single layer, thin-film thermoelectric devices developed on different flexible substrates. With the new sandwich-like apparatus design, a stably controlled temperature gradient environment is created on the test sample, and spring type probes are employed for Seebeck coefficient extraction so that the measurements are faster and more accurate. With the experimental results on Seebeck coefficient acquirements, capability of the new apparatus was verified with reproducible data.
ISSN:2150-5942
DOI:10.1109/IMPACT.2017.8255930