An embedded device technology based on a molded reconfigured wafer

• Published in: 56th Electronic Components and Technology Conference 2006 p. 5 pp.
• Main Authors: Brunnbauer, M., Furgut, E., Beer, G., Meyer, T., Hedler, H., Belonio, J., Nomura, E., Kiuchi, K., Kobayashi, K.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 2006
• Subjects: Assembly; Chemical technology; Costs; Electronic packaging thermal management; Laminates; Semiconductor device packaging; Silicon; Space technology; Testing; Wafer scale integration
• ISBN: 1424401526; 9781424401529
• ISSN: 0569-5503
• DOI: 10.1109/ECTC.2006.1645702

We report an innovative embedded device wafer level packaging technology based on a "molded reconfigured 200 mm wafer". Silicon dice are tested, grinded, and diced. For the set-up of the "reconfigured wafer" these bare silicon dice are placed faces down onto a carrier system. The core process of this technology is the encapsulation of silicon dice. We demonstrate that compression molding is a promising approach with respect to robust processing, topology, adhesion, and reliability properties. The "molded reconfigured wafer" is the base to apply thin-film interconnects similar to back-end of line processes