Dynamic Compact Thermal Model for stacked-die components

• Published in: 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) pp. 20 - 28
• Main Authors: Monier-Vinard, E., Dia, C. T., Bissuel, V., Laraqi, N., Daniel, O.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.03.2012
• Subjects: Boundary conditions; Capacitance; DELPHI methodology; Dynamic compact thermal model; Genetic Algorithm; Genetic algorithms; Heating; Junctions; Stackeddie; Thermal resistance; Thermal simulation; Transient; Transient analysis
• ISBN: 9781467311106; 1467311103
• ISSN: 1065-2221; 2577-1000
• DOI: 10.1109/STHERM.2012.6188821

The present work proposes an approach to generate Dynamic Compact Thermal Models or "DCTMs" dedicated to electronic components. This one is based on the European project DELPHI, which defined the first comprehensive methodology concerning the generation of thermal behavioral model, Boundary Condition Independent, called Compact Thermal Models or "CTMs". Unfortunately, the scope of "CTMs" was limited to the steady state as well as for single chip packages. But, the latest trend toward higher and higher density packaging using several chips requires henceforth a methodology capable to take into account the transient regime for 3D integration technologies like stacked-die solution. Following the CTM's modus operandi the DCTMs were conceived to propose a RC network able to predict a set of sensitive component temperatures with a minimized difference during component duty cycle. This work suggests the use of the genetic algorithms fitting technique that turns out relevant for the realization of DCTM, as well as the conventional DELPHI CTM.