Optimization design of a 64-Lead Low-Profile Quad Flat Package for RFIC applications

Simple process and low cost are the two major advantages of lead frame package, but the application bandwidth has been limited by its fixed structure. Based on commercial electromagnetic analysis software HFSS, a standard 64-Lead Low-Profile Quad Flat Package was used to create optimized package mod...

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Bibliographic Details
Published in2010 11th International Conference on Electronic Packaging Technology and High Density Packaging pp. 499 - 502
Main Authors Haiyan Sun, Jianhui Wu, Ling Sun, Weiping Jing
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.08.2010
Subjects
Bandwidth
Couplings
Equivalent circuits
Integrated circuit modeling
Lead
Packaging
Radiofrequency integrated circuits
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ISBN9781424481408
1424481406
DOI10.1109/ICEPT.2010.5582665

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Summary:Simple process and low cost are the two major advantages of lead frame package, but the application bandwidth has been limited by its fixed structure. Based on commercial electromagnetic analysis software HFSS, a standard 64-Lead Low-Profile Quad Flat Package was used to create optimized package model and its S parameters were simulated. Simulation results indicate that the optimized model has extended the RFIC package bandwidth to higher frequencies. The bandwidth measured for insertion loss (S31), return loss (S11), and coupling (S21) is 4.7GHz (at -1dB), 4.9GHz (at -15dB), and 2.7GHz (at -15dB). Compared with the standard LQFP64 package, we find that the bandwidth of S31, S11, and S21 is increased 34%, 58%, and 69% respectively.
ISBN:9781424481408
1424481406
DOI:10.1109/ICEPT.2010.5582665