Wafer-level integration technology of surface mount devices using automatic parts alignment technology with vibration

This paper presents a new wafer-level integration technology of discrete surface mount devices (SMDs) on silicon-wafers. It is automatic parts alignment on silicon-wafer by means of gravity force and vibration. After silicon IC process, deep holes were formed by deep reactive ion etching (DRIE) proc...

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Published inThe 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05 Vol. 2; pp. 1322 - 1325 Vol. 2
Main Authors Sudou, M., Takao, H., Sawada, K., Ishida, M.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2005
Subjects
Assembly
Etching
Fabrication
Gravity
Instruments
Integrated circuit technology
Micromechanical devices
Productivity
Silicon
Surface-mount technology
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Summary:This paper presents a new wafer-level integration technology of discrete surface mount devices (SMDs) on silicon-wafers. It is automatic parts alignment on silicon-wafer by means of gravity force and vibration. After silicon IC process, deep holes were formed by deep reactive ion etching (DRIE) process to arrange SMDs. Then a non-conductivity adhesive was spin coated and removed it on the silicon-wafer surface leaving the adhesive at the bottom of the holes. We fixed the silicon-wafer diagonally to a vibration generator and distribute SMDs on it. By vibrating the silicon-wafer, SMDs go down to the lower side occupying the holes automatically. As a result, two different sizes of SMDs were successfully mounted into every hole on silicon wafer. This technology is promising to integrate various discrete devices on integrated devices with batch process-like productivity.
ISBN:0780389948
9780780389946
ISSN:2159-547X
DOI:10.1109/SENSOR.2005.1497324