A 60 GHz Rotman lens on a silicon wafer for system-on-a-chip and system-in-package applications

As a semiconductor microfabrication process is advanced, there are needs for implementing various components on a wafer. A 60 GHz Rotman lens on a silicon wafer has been proposed for system-on-a-chip (SoC) and system-in-package (SiP) applications. The lens was fabricated on a high resistivity silico...

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Bibliographic Details
Published in2009 IEEE MTT-S International Microwave Symposium Digest pp. 1189 - 1192
Main Authors Woosung Lee, Jaeheung Kim, Choon Sik Cho, Young Joong Yoon
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.06.2009
Subjects
Application software
Conductivity
Dielectric resonator antennas
Dipole antennas
high resistivity silicon wafer
Lenses
Optical design
Radio frequency
Rotman lens
Silicon
SiP
SoP
Space technology
System-on-a-chip
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Summary:As a semiconductor microfabrication process is advanced, there are needs for implementing various components on a wafer. A 60 GHz Rotman lens on a silicon wafer has been proposed for system-on-a-chip (SoC) and system-in-package (SiP) applications. The lens was fabricated on a high resistivity silicon wafer in semiconductor process. The lens has five beam ports and seven array ports. It was observed from the measurement that the phase and the amplitude of the Rotman lens are well distributed. The beam patterns were synthesized from the measured S-parameters. The beam directions are plusmn30deg plusmn16deg, and 0deg, and the half power beam width are 15.37deg, 14.68deg, 14.53deg, 14.68deg, and 15.37deg, respectively. The feasibility of the lens on a silicon wafer has been well explored.
ISBN:1424428033
9781424428038
ISSN:0149-645X
2576-7216
DOI:10.1109/MWSYM.2009.5165915