Failure analysis and test for high speed packaging, HDMI packaging and QSFP packaging

In this paper we present several failures in optical packaging. Then we analysis the main reasons of these failures. Next, we suggest ways to avoid similar failures. Several simple examinations are also introduced. Innovative diagnostics methods are described and time saving test methods are describ...

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Bibliographic Details
Published in2010 11th International Conference on Electronic Packaging Technology & High Density Packaging pp. 1158 - 1161
Main Authors Haifei Xiang, Jian Song, Fengman liu, Wei Gao, Baoxia Li, Lixi Wan
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.08.2010
Subjects
Bonding
Electrostatic discharge
Force
Gold
Optical fibers
Packaging
Partial discharges
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Summary:In this paper we present several failures in optical packaging. Then we analysis the main reasons of these failures. Next, we suggest ways to avoid similar failures. Several simple examinations are also introduced. Innovative diagnostics methods are described and time saving test methods are described.
ISBN:9781424481408
1424481406
DOI:10.1109/ICEPT.2010.5582750