MOLD type multifunctional FEA/SNOM device

Summary form only given. In this paper, a new concept of field emitting array fabrication method is tested. The most important feature of the concept is a formation of a hole at the bottom of a reverse pyramid, anisotropically etched in (100) oriented silicon substrate.

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Bibliographic Details
Published inIEEE/CPMT/SEMI. 28th International Electronics Manufacturing Technology Symposium (Cat. No.03CH37479) p. 187
Main Authors Dziuban, J., Gorecka-Drzazga, A., Bargiel, S.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2003
Subjects
Anisotropic magnetoresistance
Electronic equipment testing
Field emitter arrays
Oxidation
Photonics
Silicon carbide
Temperature control
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Summary:Summary form only given. In this paper, a new concept of field emitting array fabrication method is tested. The most important feature of the concept is a formation of a hole at the bottom of a reverse pyramid, anisotropically etched in (100) oriented silicon substrate.
ISBN:4818195154
9784818195158
DOI:10.1109/IVMC.2003.1223046