Impact of data center cooling strategies on component reliability

In a data center environment, the temperature that a chip experiences is an important parameter determining its reliability. A high operating temperature can cause it to wearout prematurely. A low temperature results in additional cooling costs to operate the data center. In typical data center oper...

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Bibliographic Details
Published in2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) pp. 197 - 201
Main Authors Daniel, Abishai, Ahuja, Nishi
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.03.2014
Subjects
Air Conditioning Unit
Air Handling Unit
Component reliability
Computer room air conditioner
Cooling
gate oxide (TDDB) mechanism
Integrated circuit reliability
Logic gates
Temperature distribution
Temperature sensors
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Summary:In a data center environment, the temperature that a chip experiences is an important parameter determining its reliability. A high operating temperature can cause it to wearout prematurely. A low temperature results in additional cooling costs to operate the data center. In typical data center operation, there arises a distribution of component temperatures that are sensitive to the specific cooling strategies being used. This paper evaluates the impact of various data center cooling strategies on component reliability focusing on the gate oxide time dependent dielectric breakdown (TDDB) mechanism on a 32nm chipset component.
ISSN:1065-2221
2577-1000
DOI:10.1109/SEMI-THERM.2014.6892239