Validating the transmission-line based material property extraction procedure including surface roughness for multilayer PCBs using simulations

Accurate frequency-dependent dielectric properties are important for accurate modeling of signal and power integrity problems. One method for extracting dielectric properties from fabricated multilayer printed circuit boards is based on the measured electrical property of fabricated transmission lin...

Full description

Saved in:
Bibliographic Details
Published in2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) pp. 472 - 477
Main Authors Shuai Jin, Xiang Fang, Bichen Chen, Han Gao, Xiaoning Ye, Jun Fan
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.07.2016
Subjects
Attenuation
conductor roughness
Conductors
Dielectric losses
electrical property of transmission line
Material properties
material property extraction
procedure validation
Propagation constant
Rough surfaces
sensitivity analysis
Online AccessGet full text

Cover

Abstract Accurate frequency-dependent dielectric properties are important for accurate modeling of signal and power integrity problems. One method for extracting dielectric properties from fabricated multilayer printed circuit boards is based on the measured electrical property of fabricated transmission lines, denoted the "Root-omega" method. In this paper, the "Root-omega" method applied to the cases with smooth and rough conductors is validated using simulations. Potential errors in the procedure are discussed.
AbstractList Accurate frequency-dependent dielectric properties are important for accurate modeling of signal and power integrity problems. One method for extracting dielectric properties from fabricated multilayer printed circuit boards is based on the measured electrical property of fabricated transmission lines, denoted the "Root-omega" method. In this paper, the "Root-omega" method applied to the cases with smooth and rough conductors is validated using simulations. Potential errors in the procedure are discussed.
Author Xiang Fang
Xiaoning Ye
Bichen Chen
Han Gao
Shuai Jin
Jun Fan
Author_xml – sequence: 1
  surname: Shuai Jin
  fullname: Shuai Jin
  email: sjfx7@mst.edu
– sequence: 2
  surname: Xiang Fang
  fullname: Xiang Fang
  email: xfqfd@mst.edu
– sequence: 3
  surname: Bichen Chen
  fullname: Bichen Chen
  email: bcpr8@mst.edu
– sequence: 4
  surname: Han Gao
  fullname: Han Gao
  email: hg6p2@mst.edu
– sequence: 5
  surname: Xiaoning Ye
  fullname: Xiaoning Ye
  email: xiaoning.ye@intel.com
– sequence: 6
  surname: Jun Fan
  fullname: Jun Fan
  email: jfan@mst.edu
BookMark eNotkEtOwzAURQ0CibZ0AzDxBlL8_EmcIUQFKhWBxEfMKjd5aY0Sp7Idia6CLZNCR1e6OvcM7picuc4hIVfAZgAsv1m8zp-KGWeQzjKVQZrLEzIGxXIGUvLPUzLioHQCAPqCTEP4YowNuzQXMCI_H6axlYnWbWjcIo3euNDaEGznksY6pGsTsKKtieitaejOdzv0cU_xe2DLOHCHrsSq90itK5u-OshC72tTIvVdv9k6DIHWnadt30TbmD16-lLcBdqHP9YOvTmowiU5r00TcHrMCXm_n78Vj8ny-WFR3C4TC5mKicSKyVqjMEzKVLJ8rVIJJTdZrrlYa4UiQ-RSlyqvtJAVKpUKlJxnqTYcxIRc_3stIq523rbG71fH_8QvqoVqCQ
ContentType Conference Proceeding
DBID 6IE
6IH
CBEJK
RIE
RIO
DOI 10.1109/ISEMC.2016.7571694
DatabaseName IEEE Electronic Library (IEL) Conference Proceedings
IEEE Proceedings Order Plan (POP) 1998-present by volume
IEEE Xplore All Conference Proceedings
IEL
IEEE Proceedings Order Plans (POP) 1998-present
DatabaseTitleList
Database_xml – sequence: 1
  dbid: RIE
  name: IEL
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
EISBN 150901442X
9781509014422
EISSN 2158-1118
EndPage 477
ExternalDocumentID 7571694
Genre orig-research
GroupedDBID 6IE
6IF
6IH
6IK
6IL
6IM
6IN
AAJGR
ACGFS
ADZIZ
ALMA_UNASSIGNED_HOLDINGS
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
CBEJK
CHZPO
IEGSK
IJVOP
IPLJI
M43
OCL
RIE
RIL
RIO
RNS
ID FETCH-LOGICAL-i175t-4ed04f8e3a0446409b5641c2a79823b85e37ee248c59d834de5563e422768a213
IEDL.DBID RIE
IngestDate Wed Jun 26 19:26:17 EDT 2024
IsPeerReviewed false
IsScholarly true
Language English
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-i175t-4ed04f8e3a0446409b5641c2a79823b85e37ee248c59d834de5563e422768a213
PageCount 6
ParticipantIDs ieee_primary_7571694
PublicationCentury 2000
PublicationDate 2016-July
PublicationDateYYYYMMDD 2016-07-01
PublicationDate_xml – month: 07
  year: 2016
  text: 2016-July
PublicationDecade 2010
PublicationTitle 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)
PublicationTitleAbbrev ISEMC
PublicationYear 2016
Publisher IEEE
Publisher_xml – name: IEEE
SSID ssj0001096931
Score 2.1548893
Snippet Accurate frequency-dependent dielectric properties are important for accurate modeling of signal and power integrity problems. One method for extracting...
SourceID ieee
SourceType Publisher
StartPage 472
SubjectTerms Attenuation
conductor roughness
Conductors
Dielectric losses
electrical property of transmission line
Material properties
material property extraction
procedure validation
Propagation constant
Rough surfaces
sensitivity analysis
Title Validating the transmission-line based material property extraction procedure including surface roughness for multilayer PCBs using simulations
URI https://ieeexplore.ieee.org/document/7571694
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LT8MwDI7GTnDhsSHeyoEj7do06ePKtGkgDU2Cod2mtHXRxOimrj3An-AvY7fdBogDt6hq5CpO48-OP5uxaym069gKfyQ014YEgSNIwLAVBIkMIkcBhQaGD-5gLO8natJgNxsuDACUyWdg0rC8y48XUUGhso6nqLaL3GE7viUqrtY2noJYPHDsNS_GCjp3j71hl5K3XLOe-KODSmlA-vtsuBZd5Y28mkUemtHHr6qM__22A9beUvX4aGOEDlkD0iO2963KYIt9PiPWJhZD-sIR7vGczBOql-JkBqFMTqYs5ohdy-3IlxSgz_J3jgd3VhEfeGno4iIDPkujeUHC-KrIEo3yy04_dGRyRMC8TFGca4TyfNS9XXHKrMd3Z291o7BVm437vafuwKj7MBgzBBc5ajC2ZOKDo-n2Fx3CULnSjoT2Al84oY_q9ACE9CMVxL4jY6CqYyCFQF9GC9s5Zs10kcIJ467lxcSDVokMpfRkGApfA7qMoH0dSDhlLVra6bIqtTGtV_Xs78fnbJfUW2XPXrBmnhVwiRghD6_KzfEFClm_qg
link.rule.ids 310,311,786,790,795,796,802,23958,23959,25170,27958,55109
linkProvider IEEE
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LT8JAEN4gHtSLDzC-3YNHC3S7fV0lEFAgJILhRrbt1BCxkNIe9E_4l51pCz7iwdum6Wabne1-387ON8PYjRTKMnQTfySEa02CwBaEoOkmuKF0fcMEcg30B1ZnLO8n5qTEbjdaGADIgs-gRs3sLj9Y-Cm5yuq2Sbld5BbbRpxvuLla68ujgmzcNfS1Mqbh1ruPrX6TwresWtH1Rw2VDELa-6y_HjyPHHmppYlX899_5WX879cdsOqXWI8PNzB0yEoQHbG9b3kGK-zjCdk26RiiZ46EjycEUGhg8pRpxDM5gVnAkb1mC5IvyUUfJ28ct-44lz7wDOqCNAY-i_x5SoPxVRqHCsfPav3QpsmRA_MsSHGukMzzYfNuxSm2Ht-dvRalwlZVNm63Rs2OVlRi0GZILxK0YdCQoQOGovtfPBJ6piV1XyjbdYThOWhQG0BIxzfdwDFkAJR3DKQQeJpRQjeOWTlaRHDCuNWwA1JCm6H0pLSl5wlHAR4aQTnKlXDKKjS102WebGNazOrZ34-v2U5n1O9Ne93BwznbJVPnsbQXrJzEKVwiY0i8q2yhfAJMYMMA
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=proceeding&rft.title=2016+IEEE+International+Symposium+on+Electromagnetic+Compatibility+%28EMC%29&rft.atitle=Validating+the+transmission-line+based+material+property+extraction+procedure+including+surface+roughness+for+multilayer+PCBs+using+simulations&rft.au=Shuai+Jin&rft.au=Xiang+Fang&rft.au=Bichen+Chen&rft.au=Han+Gao&rft.date=2016-07-01&rft.pub=IEEE&rft.eissn=2158-1118&rft.spage=472&rft.epage=477&rft_id=info:doi/10.1109%2FISEMC.2016.7571694&rft.externalDocID=7571694