Development of green molding compound for high voltage discrete package

The market demand of discrete is very big in semiconductor package. A lot of discrete package is transferring to green compound which are surface mounting design and high voltage power application. It must pass the relative electrical performance and standard JEDEC Level testing. Currently green mol...

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Bibliographic Details
Published in2010 11th International Conference on Electronic Packaging Technology and High Density Packaging pp. 148 - 151
Main Authors Guangchao Xie, Jianhua Ruan, Yue Wang, Xinyu Du, Xingming Cheng
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.08.2010
Subjects
Adhesives
Copper
Delamination
Discrete
EMC
HTRB
Moldability
Silicon compounds
Stress
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Summary:The market demand of discrete is very big in semiconductor package. A lot of discrete package is transferring to green compound which are surface mounting design and high voltage power application. It must pass the relative electrical performance and standard JEDEC Level testing. Currently green molding compound always meet some H(3)TRB failure on high voltage device and delamination issue after MSL1 precondition with lead free soldering condition. It becomes a challenge for molding compound supplier to design suitable green material to satisfy both reliability and moldability test. In this study, the failure mode of HTRB was discussed and some key raw materials were tested in formulation to understand different raw material effect on HTRB performance. The adhesion to lead frame was measured to show different material effect on interfacial adhesion strength. All materials were molded on SOT23 test vehicle and subject to HTRB and Standard JEDEC Level testing. The long term moldability was also tested in this study. It was found with certain material had good HTRB result on SOT package with high voltage application.
ISBN:9781424481408
1424481406
DOI:10.1109/ICEPT.2010.5582460