A novel RF self test for a combo SoC on digital ATE with multi-site applications
Recently, system-on-chip (SoC) solutions have been realized by integrating not only complex digital processing but also extensive analog and radio frequency (RF) circuits in a single chip. This paper presents a novel RF self test methodology suitable for complex radio SoC's. The proposed method...
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Published in | 2014 International Test Conference pp. 1 - 8 |
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Main Authors | , , , , , , , , , , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
01.10.2014
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Subjects | |
Online Access | Get full text |
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Summary: | Recently, system-on-chip (SoC) solutions have been realized by integrating not only complex digital processing but also extensive analog and radio frequency (RF) circuits in a single chip. This paper presents a novel RF self test methodology suitable for complex radio SoC's. The proposed methodology employs the digital processor embedded in an SoC to enable self-testing using low-cost digital automatic test equipments (ATE). Moreover, to achieve increased RF test coverage achievable through internal loopback, the embedded processor also utilizes a compact assisted test board and interfaces to it through simple general purpose I/O's (GPIO). The proposed self-test methodology has been successfully applied in the mass production (MP) of a 65nm CMOS combo SoC that includes Wi-Fi, Bluetooth, GPS and FM. The final test (FT) and wafer probe test (PT) of the SoC have been accomplished with a 3X reduction in total test time compared to conventional test methodology using RF instruments. |
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ISSN: | 1089-3539 2378-2250 |
DOI: | 10.1109/TEST.2014.7035303 |