A novel RF self test for a combo SoC on digital ATE with multi-site applications

Recently, system-on-chip (SoC) solutions have been realized by integrating not only complex digital processing but also extensive analog and radio frequency (RF) circuits in a single chip. This paper presents a novel RF self test methodology suitable for complex radio SoC's. The proposed method...

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Bibliographic Details
Published in2014 International Test Conference pp. 1 - 8
Main Authors Chun-Hsien Peng, ChiaYu Yang, Tsu, Adonis, Chung-Jin Tsai, Yosen Chen, Lin, C.-Y, Kai Hong, Kaipon Kao, Liang, Paul, Tsai, C.-L, Chien, Charles, Hwang, H.-C
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.10.2014
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Summary:Recently, system-on-chip (SoC) solutions have been realized by integrating not only complex digital processing but also extensive analog and radio frequency (RF) circuits in a single chip. This paper presents a novel RF self test methodology suitable for complex radio SoC's. The proposed methodology employs the digital processor embedded in an SoC to enable self-testing using low-cost digital automatic test equipments (ATE). Moreover, to achieve increased RF test coverage achievable through internal loopback, the embedded processor also utilizes a compact assisted test board and interfaces to it through simple general purpose I/O's (GPIO). The proposed self-test methodology has been successfully applied in the mass production (MP) of a 65nm CMOS combo SoC that includes Wi-Fi, Bluetooth, GPS and FM. The final test (FT) and wafer probe test (PT) of the SoC have been accomplished with a 3X reduction in total test time compared to conventional test methodology using RF instruments.
ISSN:1089-3539
2378-2250
DOI:10.1109/TEST.2014.7035303