Research on the rework process of the ceramic ball grid array package

Ceramic ball grid array (CBGA) package is becoming increasingly popular as a high-density, high I/O count and high-performance packaging formation in the application of the aviation and spaceflight area. However, the undeveloped rework process restricts the development of the CBGA process and the ap...

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Bibliographic Details
Published in2013 14th International Conference on Electronic Packaging Technology pp. 976 - 980
Main Authors Yingzhuo Huang, Bo Huang, Pengrong Lin, Yusheng Cao, Binhao Lian, Quanbin Yao
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.08.2013
Subjects
Ceramics
Electronics packaging
Joints
Reliability
Substrates
Surface morphology
Testing
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Summary:Ceramic ball grid array (CBGA) package is becoming increasingly popular as a high-density, high I/O count and high-performance packaging formation in the application of the aviation and spaceflight area. However, the undeveloped rework process restricts the development of the CBGA process and the application of the CBGA component. This paper made a research on the rework process of the CBGA package, it specifically discussed the coplanarity, the position, the void rate and the solder joint strength. By design of the daisy-chain substrate, the board-level reliability of the CBGA package was investigated. This study showed that the reworked CBGA component with high strength, low void rate, good coplanarity and high reliability was available by the proper rework process and could meet the requirement of the formal product.
DOI:10.1109/ICEPT.2013.6756623