Sensitivity study of channel termination on vertical side-chip interconnection
This paper investigates the sensitivity of channel termination on vertical side-chip interconnection (VSCI), an alternative high density and low z-height enabler for 3D packaging technology. In this study, the trends of eye height opening, one of the critical signaling parameters, were analyzed base...
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Published in | 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) pp. 1 - 5 |
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Main Authors | , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
01.11.2012
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Online Access | Get full text |
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Summary: | This paper investigates the sensitivity of channel termination on vertical side-chip interconnection (VSCI), an alternative high density and low z-height enabler for 3D packaging technology. In this study, the trends of eye height opening, one of the critical signaling parameters, were analyzed based on transmission channel length, input rise time, receiver device capacitance and termination resistance factors. Simulation results show potential solution space for weak receiver termination to achieve >350mV eye height opening (based on 1V supply voltage) at 30Gbps. Key enabling factors and design trade-offs were discussed and summarized in this paper for future design considerations. |
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ISBN: | 9781467343848 1467343846 |
ISSN: | 1089-8190 2576-9626 |
DOI: | 10.1109/IEMT.2012.6521778 |