Air-gap transmission lines for multiprocessor interconnects on FR-4 and BT substrates

The fabrication and characterization of low loss parallel plate and microstrip lines with an air dielectric layer is described. The lines are characterized by capacitance and loss tangent at 10 kHz and 100 kHz and by S-parameters up to 10 GHz. The inclusion of the air-gap significantly reduced the l...

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Bibliographic Details
Published in2007 IEEE International Interconnect Technology Conferencee pp. 34 - 36
Main Authors Spencer, T.J., Kohl, P.A.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.06.2007
Subjects
Air gaps
Dielectric constant
Dielectric losses
Dielectric substrates
Integrated circuit interconnections
Land surface temperature
Polymers
Power transmission lines
Propagation losses
Transmission lines
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Summary:The fabrication and characterization of low loss parallel plate and microstrip lines with an air dielectric layer is described. The lines are characterized by capacitance and loss tangent at 10 kHz and 100 kHz and by S-parameters up to 10 GHz. The inclusion of the air-gap significantly reduced the loss tangent and lowered the dielectric constant to between 1.5 and 1.8. More complicated transmission line structures could be fabricated using the described techniques.
ISBN:9781424410699
142441069X
ISSN:2380-632X
2380-6338
DOI:10.1109/IITC.2007.382344