Analysis of the phenomenon of falling off of indium bumps from substrate during reflow process

Indium bumping is a crucial technology in FPAs (focal plane array) application. In this paper, electroplating method is tried to prepare the indium bump arrays. But one difficulty appears during the reflow process. In such process, many indium bumps fall off from the substrate. To solve such problem...

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Bibliographic Details
Published in2010 11th International Conference on Electronic Packaging Technology and High Density Packaging pp. 267 - 270
Main Authors Qiuping Huang, Dongliang Wang, Gaowei Xu, Yuan Yuan, Quan Wang, Le Luo
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.08.2010
Subjects
Finite element methods
Gold
Indium
Semiconductor device modeling
Strain
Stress
Substrates
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ISBN9781424481408
1424481406
DOI10.1109/ICEPT.2010.5582421

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Summary:Indium bumping is a crucial technology in FPAs (focal plane array) application. In this paper, electroplating method is tried to prepare the indium bump arrays. But one difficulty appears during the reflow process. In such process, many indium bumps fall off from the substrate. To solve such problem, its possible causes are discussed and the corresponding measures are taken. Experimental results show that the measures can effectively improve status of the falling off of indium bumps, which is consistent with the reasonable analysis. To analyze the influence of reflow process to the stress in the bump system, finite element analysis with ANSYS is adopted in this paper.
ISBN:9781424481408
1424481406
DOI:10.1109/ICEPT.2010.5582421