Flip chip CBGA package design and simulation

The Flip chip ceramic package, is a promising choice for high density integration applications such as CPU and FPGA. Excellent attributes of this advanced package include very good electrical performance and excellent thermal characteristics. In this paper, for a given die, we firstly designed a fli...

Full description

Saved in:
Bibliographic Details
Published in2013 14th International Conference on Electronic Packaging Technology pp. 555 - 558
Main Authors Xie Wenjun, Cao Yusheng, Yao Quanbin
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.08.2013
Subjects
Capacitance
CBGA
electrical and thermal simulation
Electronic packaging thermal management
Flip chip package
Flip-chip devices
Heat sinks
Inductance
Resistance
Software
Online AccessGet full text

Cover

More Information
Summary:The Flip chip ceramic package, is a promising choice for high density integration applications such as CPU and FPGA. Excellent attributes of this advanced package include very good electrical performance and excellent thermal characteristics. In this paper, for a given die, we firstly designed a flip chip ceramic ball grid array package which has 675 I/O (1.0 mm pitch) in package design software, and then simulated the lumped resistance, inductance, capacitance and insertion loss of a differential signal pair in EM simulation software, respectively. Lastly, we simulated the thermal distribution and thermal resistance difference of the package with and without heat sink added in thermal simulation software. From the thermal simulation, we can see that adding a heat sink would decrease the thermal resistance effectively.
DOI:10.1109/ICEPT.2013.6756533