Fast parametric pre-layout analysis of signal integrity for backplane interconnects

The effective design of passive interconnect links in a pre-layout phase may be a challenging task that involve multidimensional trade-off analyses to find an optimum between system performance and cost. Highly efficient interconnect models can be used to assist this process by allowing a detailed e...

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Bibliographic Details
Published in2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI) pp. 51 - 54
Main Authors Rimolo-Donadio, Renato, Winkel, T., Siviero, C., Kaller, D., Harrer, H., Bruns, H., Schuster, C.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.05.2011
Subjects
Analytical models
Backplanes
Cavity resonators
Integrated circuit interconnections
Integrated circuit modeling
Nonhomogeneous media
Substrates
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Summary:The effective design of passive interconnect links in a pre-layout phase may be a challenging task that involve multidimensional trade-off analyses to find an optimum between system performance and cost. Highly efficient interconnect models can be used to assist this process by allowing a detailed exploration of the design space and the impact of different alternatives in an early stage. This paper addresses this issue by proposing a parametric and automated framework for analysis of single-ended links across multiple substrates with semi-analytical via and trace models. It is shown that this method can provide rapid estimations (second to minute range) and it is suitable for the analysis of configurations with realistic complexity.
ISBN:9781457704666
1457704668
DOI:10.1109/SPI.2011.5898839