Non-contact direct metallization of a crystalline silicon solar cell by electrostatic-force-assisted dispensing printing

As the industrial demand on new front grid metallization with high aspect ratio on a crystalline silicon solar cell wafer as thin as 100 μm increases, diverse non-contact printing techniques have been developed. Dispensing printing among the explored non-contact printing techniques has drawn wide at...

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Bibliographic Details
Published in2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC) pp. 2980 - 2982
Main Authors Hee-eun Song, Dong-Youn Shin, Sung-Soo Yoo, Hyowon Tak, Doyoung Byoun
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.06.2016
Subjects
adhesion
contact resistivity
crystalline silicon solar cell
dispensing
Electrodes
electrostatic force
Metallization
Photovoltaic cells
Printing
Silicon
Silver
Stress
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Summary:As the industrial demand on new front grid metallization with high aspect ratio on a crystalline silicon solar cell wafer as thin as 100 μm increases, diverse non-contact printing techniques have been developed. Dispensing printing among the explored non-contact printing techniques has drawn wide attention due to its simplicity and capability to meet the industrial requirements. However, the employment of highly viscous silver paste with high yield stress hampers sound mechanical contact of silver paste on the textured surface of a crystalline silicon solar cell. In this work, a newly developed printing technique, i.e., `electrostatic-force-assisted dispensing printing,' is demonstrated and its impact on mechanical adhesion and electrical characteristics is discussed.
DOI:10.1109/PVSC.2016.7750208