System level drop reliability method research for netbook memory module

• Published in: 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging pp. 1043 - 1048
• Main Authors: Minyi Lou, Jianwei Zhou, Long Wen, Weiwei Feng, Jaisung Lee
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.08.2010
• Subjects: Computational modeling; Finite element methods; Predictive models; Reliability; Soldering; Strain; Stress
• ISBN: 9781424481408; 1424481406
• DOI: 10.1109/ICEPT.2010.5582716

Prevalence of portable devices such as netbook led to increased concerns on drop reliability of FBGA. In order to investigate drop reliability, board level drop test according to Jedec is done in assembly and SMT company, whereas system drop test such as netbook drop test is processed in final product company. In general, the lifetime of Jedec board level drop test and the lifetime of system drop test are different. So it's necessary to develop some board level drop test method which can be equal to system drop test, not only the similar lifetime, but also the same failure mode. In addition, electrolytic NiAu finished DRAM product has begun to be taken place in ENEPIG finished, at the same time ENIG finished board has been replaced by OSP finished board in memory module for cost reduction. The results showed, board level drop test specification was established (84BOC: 1cyc = 2900G*1 + 1500G*2, 60BOC: 1cyc = 900G*3 + 500G*1 + 340G*1) for FBGA package-applied memory module with OSP finished board. And the lifetime and failure modes of system board level drop test and netbook drop test are similar. In addition, ENEPIG finished was a little better than traditional NiAu finished in drop reliability test.