High Level Integrated ICs for Low Cost, Compact, WiMax Dual-band RF Modules

High level integrated passive and active ICs on GaAs substrates are developed for low cost, compact size WiMax dual-band RF module applications.

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Bibliographic Details
Published in2007 IEEE/MTT-S International Microwave Symposium pp. 267 - 270
Main Authors Yuen, C., Laursen, K., Due Chu, Adams, M., Hai Nguyen
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.06.2007
Subjects
Baluns
Bandpass Filters
Costs
Diplexers
Dual band
Gallium arsenide
Impedance matching
Integrated Passive Die
Personal communication networks
Power Amplifier
Radio frequency
Radiofrequency integrated circuits
Switches
Testing
WiMAX
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Summary:High level integrated passive and active ICs on GaAs substrates are developed for low cost, compact size WiMax dual-band RF module applications.
ISBN:1424406870
9781424406876
ISSN:0149-645X
2576-7216
DOI:10.1109/MWSYM.2007.380379