Failure behavior and life prediction of through-hole solder joints under thermal cycling

Pin-through-hole (PTH) connection is one of the most common types of connection between components and circuit board. Taking the printed circuit board (PCB) of the typical electronic product air conditioner as research object, thermal fatigue behavior and failure mechanism of the through-hole solder...

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Bibliographic Details
Published in2010 11th International Conference on Electronic Packaging Technology & High Density Packaging pp. 1007 - 1012
Main Authors Hui Xiao, Xiaoyan Li, Na Liu, Yongchang Yan
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.08.2010
Subjects
Copper
Creep
Electronics packaging
Failure analysis
Soldering
Strain
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Summary:Pin-through-hole (PTH) connection is one of the most common types of connection between components and circuit board. Taking the printed circuit board (PCB) of the typical electronic product air conditioner as research object, thermal fatigue behavior and failure mechanism of the through-hole solder joints were investigated by accelerated aging experiments and finite element analysis (FEA). Results showed that, besides that of the coefficient of thermal expansion (CTE) mismatch between the materials in the solder joint assembly, the influence of solder joint structure and component weight the pin supporting on the cumulative damage to solder joints were indispensable. Compared with the typical supported-hole solder joints, solder joints for this paper were more prone to the damage as component pin peeling off solder. And fatigue lives of solder joints decreased with component weight increasing. The solder joint lives calculated by FEA were between 1300~1600 cycles, which agreed well with the experimental results.
ISBN:9781424481408
1424481406
DOI:10.1109/ICEPT.2010.5582627