Design and implementation of ultra-thin SiP modules

In recent years, SiP (System-in-Package) or SOP (System on Package) technology has become an attractive solution for size reduction of mobile devices. Passive components such as inductors or capacitors can be integrated into the substrate. The dimension of embedded capacitors can be further reduced...

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Bibliographic Details
Published in2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) pp. 311 - 314
Main Authors Meng-Sheng Chen, Yung-Chung Chang, Wei-Ting Chen, Tzu-Ying Kuo, Li-Chi Chang, Cheng-Hua Tsai, Chang-Chih Liu, Chang-Sheng Chen, Cheng-Ta Ko, Yung-Yu Wang, Long-Zhen Liang
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.10.2012
Subjects
Capacitors
Electric shock
Flip chip
Global Positioning System
Substrates
Surface treatment
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Summary:In recent years, SiP (System-in-Package) or SOP (System on Package) technology has become an attractive solution for size reduction of mobile devices. Passive components such as inductors or capacitors can be integrated into the substrate. The dimension of embedded capacitors can be further reduced by using high dielectric constant material. Thus, size miniaturization and cost reduction can be easily achieved through the replacements of surface-mounted devices (SMDs) on the substrate.chip can be reduced. Wafer-level packaging technology, wafer thinning technology, buried ultra-thin chips technology, and embedded passive components technology are both integrated in this paper to achieve a miniaturized ultra-thin SiP module. The feasibility of the ultra-thin SiP technology was verified by using a GPS module. For high integration and flexible design, an eight-layered organic substrate process is used in this project.
ISBN:9781467316354
1467316350
ISSN:2150-5934
2150-5942
DOI:10.1109/IMPACT.2012.6420260