Frequency scanning of power electronic-based smart grids: The modular multilevel converter application
The Multi-terminal HVdc systems is a key technology for bulk power transmission. The stability analysis of such power electronics-dominated power systems is a new challenge. This paper focuses on the analysis based on impedance representation of a modular multilevel converter. Therefore, a small sig...
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Published in | 2013 4th IEEE International Symposium on Power Electronics for Distributed Generation Systems (PEDG) pp. 1 - 8 |
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Main Authors | , , , , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
01.07.2013
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Subjects | |
Online Access | Get full text |
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Summary: | The Multi-terminal HVdc systems is a key technology for bulk power transmission. The stability analysis of such power electronics-dominated power systems is a new challenge. This paper focuses on the analysis based on impedance representation of a modular multilevel converter. Therefore, a small signal input impedance modeling method is described for high and low frequencies. A comparative evaluation with the impedance obtained via simulations was performed by the application of a voltage perturbation to the DC side. In addition, the stability of the interconnection of two MMCs' in a Back-to-Back configuration was analyzed by means of Nyquist criteria. |
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ISSN: | 2329-5759 |
DOI: | 10.1109/PEDG.2013.6785629 |