New flip-chip assembly system for prototyping and process investigations

• Published in: 24th International Spring Seminar on Electronics Technology. Concurrent Engineering in Electronic Packaging. ISSE 2001. Conference Proceedings (Cat. No.01EX492) pp. 68 - 72
• Main Authors: Drozd, Z., Hackiewicz, H., Jezior, R., Lasocki, J., Lukasik, W., Orzechowski, J., Szwech, M.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 2001
• Subjects: Assembly systems; Biomedical engineering; Biomedical measurements; Bonding processes; Laboratories; Mass production; Materials testing; Position measurement; Prototypes; Semiconductor device measurement
• ISBN: 0780371119; 9780780371118
• DOI: 10.1109/ISSE.2001.931014

The flip-chip assembly technology and a new laboratory stand for investigation of FC bonding processes are presented. The prototype system was developed by Division of Precision and Electronic Product Technology in Institute of Precision and Biomedical Engineering of Warsaw University of Technology, in cooperation with Tele and Radio Research Institute in Warsaw. The new ideas of the system consist of application of unique measuring and positioning subsystems, assuming high precision of the chip position on the substrate. Simplicity, high precision and versatility are the main advantages of the presented system. The assembly processes are realized in prototype scale; however, the principles and physical parameters of the process are comparable with mass production processes. The stand is applied for essential tests and investigations of FC technology and materials, especially for SME. It will be also useful for didactic applications.