Issues in chip-package codesign with MCM-D/flip-chip technology

By distributing on-chip global power, ground, and clock planes on a thin film MCM, the IC can be made smaller, faster, and less noisy while consuming less power. These advantages are demonstrated by a number of case studies: two demonstrator ICs and an analysis of the DEC Alpha 21264 clock distribut...

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Bibliographic Details
Published inProceedings. 1998 IEEE Symposium on IC/Package Design Integration (Cat. No.98CB36211) pp. 88 - 92
Main Authors Franzon, P., Schaffer, T., Lipa, S., Glaser, A.
Format Conference Proceeding
LanguageEnglish
Published IEEE 1998
Subjects
Clocks
CMOS technology
Logic testing
Monitoring
Noise generators
Statistical analysis
Switches
Threshold voltage
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Summary:By distributing on-chip global power, ground, and clock planes on a thin film MCM, the IC can be made smaller, faster, and less noisy while consuming less power. These advantages are demonstrated by a number of case studies: two demonstrator ICs and an analysis of the DEC Alpha 21264 clock distribution scheme. However, there are a number of practical issues that need to be addressed, including process variations and test. In this paper, we present the case studies and a treatment of these practical issues.
ISBN:081868433X
9780818684333
DOI:10.1109/IPDI.1998.663634