Design of miniaturized RF SAW duplexer package

This paper provides a comprehensive methodology for accurate analysis and design of miniaturized RP SAW duplexer package. Full-wave analysis is applied to get the package model. Die and bonding wire modeling is also discussed. After that, improvement of the isolation is investigated. Simulation and...

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Bibliographic Details
Published inIEEE Symposium on Ultrasonics, 2003 Vol. 1; pp. 807 - 810 Vol.1
Main Authors Dong, H., Wu, T.X., Cheema, K.S., Abbott, B.P., Finch, C.A., Foo, H.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2003
Subjects
Bonding
Electronics packaging
Filters
Radio frequency
Radio transmitters
Receivers
Receiving antennas
Surface acoustic wave devices
Surface acoustic waves
Wire
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Summary:This paper provides a comprehensive methodology for accurate analysis and design of miniaturized RP SAW duplexer package. Full-wave analysis is applied to get the package model. Die and bonding wire modeling is also discussed. After that, improvement of the isolation is investigated. Simulation and measurement results are compared and excellent agreement is found. The technique developed in this paper reduces the design cycle time significantly and can be applied to various RP SAW device packages.
ISBN:9780780379220
0780379225
DOI:10.1109/ULTSYM.2003.1293523