Electrical modeling and characterization of packaging solutions utilizing lead-free second level interconnects
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Published in | 53rd Electronic Components and Technology Conference, 2003. Proceedings pp. 1270 - 1276 |
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Main Authors | , , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
2003
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Subjects | |
Online Access | Get full text |
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ISBN: | 9780780377912 0780377915 |
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ISSN: | 0569-5503 2377-5726 |
DOI: | 10.1109/ECTC.2003.1216456 |