In-situ strain measurement during epitaxy of InP based materials

We have developed an instrument to measure wafer curvature during epitaxial growth in rotating disk reactors. This instrument uses a high speed, position sensitive, laser reflectometer to accurately measure the substrate's radius of curvature. The instrument has been used to measure ternary com...

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Bibliographic Details
Published inInternational Conference onIndium Phosphide and Related Materials, 2003 pp. 40 - 43
Main Authors Hoffman, R.W., Belousov, M., Volf, B., Murphy, M., Cruel, J., Lee, D., Gurary, A., Armour, E.A.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2003
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Summary:We have developed an instrument to measure wafer curvature during epitaxial growth in rotating disk reactors. This instrument uses a high speed, position sensitive, laser reflectometer to accurately measure the substrate's radius of curvature. The instrument has been used to measure ternary compound lattice-mismatch during growth. Agreement within 60 ppm was found between strains extracted from in-situ curvature measurements and the ex-situ measured strain determined by high-resolution x-ray diffraction. Discrepancy between extracted strains for two samples was explained by the onset of pseudomorphic strain relaxation and confirmed through Hall mobility data. A correlation between Hall mobility and strain of nearly lattice-matched InGaAs on InP demonstrated the importance of in-situ strain control at growth temperature. A maximum mobility was obtained with an at growth temperature strain of 375 ppm (compressive) relative to the InP substrate and not at perfect lattice-matching conditions.
ISBN:0780377044
9780780377042
DOI:10.1109/ICIPRM.2003.1205307