Macromodels for generating signal integrity and timing management advice for package design

The electrical design of packaging for high speed digital systems requires intensive efforts on the part of signal integrity engineers. We have produced a set of tools that assist these engineers in efficiently producing PCB and MCM designs that meet timing and other electrical needs. This paper des...

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Bibliographic Details
Published inProceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) pp. 523 - 529
Main Authors Franzon, P., Simovich, S., Mehrotra, S., Steer, M.
Format Conference Proceeding
LanguageEnglish
Published IEEE 1993
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Summary:The electrical design of packaging for high speed digital systems requires intensive efforts on the part of signal integrity engineers. We have produced a set of tools that assist these engineers in efficiently producing PCB and MCM designs that meet timing and other electrical needs. This paper describes the most important aspect of this solution, the internal 'macromodels' that accurately capture the relationships between electrical/timing design and the package physical design (or layout).< >
ISBN:0780307941
9780780307940
DOI:10.1109/ECTC.1993.346796