Placement of substrate contacts to alleviate substrate noise in epi and non-epi technologies

The placement of substrate contacts in epi and non-epi technologies in order to control and reduce the substrate noise amplitude and spreading is analyzed. The choice of small or large substrate contacts or rings for each of the two major technologies are highlighted. Design guidelines for placing s...

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Bibliographic Details
Published inProceedings of the 43rd IEEE Midwest Symposium on Circuits and Systems (Cat.No.CH37144) Vol. 3; pp. 1314 - 1318 vol.3
Main Authors Secareanu, R.M., Warner, S., Seabridge, S., Burke, C., Watrobski, T.E., Morton, C., Staub, W., Tellier, T., Friedman, E.G.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2000
Subjects
Character generation
Circuit noise
Contacts
Digital circuits
Noise generators
Noise level
Power generation
Semiconductor device noise
Substrates
Working environment noise
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Summary:The placement of substrate contacts in epi and non-epi technologies in order to control and reduce the substrate noise amplitude and spreading is analyzed. The choice of small or large substrate contacts or rings for each of the two major technologies are highlighted. Design guidelines for placing substrate contacts particularly appropriate to improving the noise immunity of digital circuits in mixed-signal smart-power systems are also presented.
ISBN:9780780364752
0780364759
DOI:10.1109/MWSCAS.2000.951457