The solder joint and runner metal reliability of wafer-level CSP (Omega-CSP)

Wafer-level Chip Size Package (Wafer Level CSP)s are competing with normal CSPs because they provide the benefits of real chip size package with low manufacturing cost. However, solder joint and runner metal reliability in board level are still critical to the acceptance of WLCSP as an alternative p...

Full description

Saved in:
Bibliographic Details
Published in2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) pp. 87 - 92
Main Authors In-Soo Kang, Jong-Heon Kim, Park, I.S., Ki-Rok Hur, Soon-Jin Cho, Hun Han, Jin Yu
Format Conference Proceeding
LanguageEnglish
Published IEEE 2000
Subjects
Chip scale packaging
Costs
Dielectrics
Electronics packaging
Manufacturing
Polymers
Random access memory
Soldering
Stress
Wafer scale integration
Online AccessGet full text

Cover

More Information
Summary:Wafer-level Chip Size Package (Wafer Level CSP)s are competing with normal CSPs because they provide the benefits of real chip size package with low manufacturing cost. However, solder joint and runner metal reliability in board level are still critical to the acceptance of WLCSP as an alternative package. In Hyundai Electronics, Wafer-Level CSP without underfill, called Omega-CSP, has been developed for a high speed DRAM application. Omega CSP has a newly developed dielectric polymer as a stress buffer and modified redistribution process. This work aimed at the assessment of the solder joint reliability characteristics and the runner metal reliability. We studied and examined the reliability in terms of the property of dielectric polymer and the runner structure. According to the results, it was found that solder joint reliability strongly depended on the solder ball size and runner thickness. In addition, the effects of CTE/modulus of dielectric polymer on the reliability solder joint will be discussed.
ISBN:9780780359086
0780359089
DOI:10.1109/ECTC.2000.853124