Study on rate-dependent behaviors of underfills based on two-phase composites

Underfills' properties are very important for the reliability of flip chip packages. As epoxy based materials, underfills show obvious rate-dependent behaviors under mechanical loading. However, studies on the rate-dependent behavior of underfills have been rarely reported, In this paper, the r...

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Bibliographic Details
Published in2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) pp. 348 - 352
Main Authors Haiying Wang, Zhengfang Qian, Minfu Lu, Sheng Liu, Jiali Wu, Wong, C.P.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2000
Subjects
Additives
Conducting materials
Elasticity
Electronic packaging thermal management
Epoxy resins
Materials science and technology
Micromechanical devices
Shape
Thermal conductivity
Viscosity
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Summary:Underfills' properties are very important for the reliability of flip chip packages. As epoxy based materials, underfills show obvious rate-dependent behaviors under mechanical loading. However, studies on the rate-dependent behavior of underfills have been rarely reported, In this paper, the rate-dependent strain-stress behavior of underfills is studied based on two-phase composite assumption. A micromechanical method is employed to predict the overall strain-stress behavior of underfills. Results show good agreement between the predicted data and experimental data.
ISBN:9780780359086
0780359089
DOI:10.1109/ECTC.2000.853175