Process Control in Semiconductor Manufacturing

Solid-state devices are manufactured on disks of semiconducting material called wafers. These devices are three-dimensional structures made up of stacked two-dimensional layers. Each layer is manufactured by one or two of the four basic unit operations: deposition, patterning, doping, and heat treat...

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Bibliographic Details
Published inThe Control Handbook pp. 327 - 344
Format Book Chapter
LanguageEnglish
Published United Kingdom CRC Press 2011
Taylor & Francis Group
Subjects
Electronics engineering
ENVIRONMENTAL ENGINEERING & TECHNOLOGY
SCIENCE: GENERAL ISSUES
MPC
Product Wafers
Registration Errors
Wafer Surface
Etch Rate
Wafer Temperature
Reticle Field
RTP
ASIC
Test Wafers
Resist Thickness
Semiconductor Manufacturing
Overlay Errors
EWMA
CMP Process
Alignment Marks
SOI
Soft Bake
Plasma Etching
Feedforward Control
Hard Bake
Infrared Heat Source
Metrology Tool
EWMA Controller
Nonlinear Model Predictive Control Scheme
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ISBN9781420073607
1420073605
DOI10.1201/b10382-20

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Summary:Solid-state devices are manufactured on disks of semiconducting material called wafers. These devices are three-dimensional structures made up of stacked two-dimensional layers. Each layer is manufactured by one or two of the four basic unit operations: deposition, patterning, doping, and heat treatment; see Table 11.1 for examples of each operation. The purpose of deposition is to grow a thin layer of a specific material onto the wafer surface. Patterning is the process of selective removal of the top layer (or layers) of the wafer. In the doping processes the conductivity and resistivity of the wafer surface are altered by adding specific contaminants to the exposed areas of the wafer. Finally, heat treatment raises or lowers the wafer temperature to evaporate solvents or anneal the surface [1].
ISBN:9781420073607
1420073605
DOI:10.1201/b10382-20