Thermal On-Board Spectroscopy: Thermal Impedance Simulation Using FEM and Thermal Modelling

• Published in: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) pp. 1 - 8
• Main Authors: Khatib, Mohamad El, Reitz, Sven, Warmuth, Jens
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.07.2020
• Subjects: Adaptation models; Electronic packaging thermal management; Heating systems; Semiconductor device measurement; Solid modeling; Temperature measurement; Thermal sensors
• DOI: 10.1109/EuroSimE48426.2020.9152637

Autonomous driving, together with electromobility, is the next major innovation step in future mobility. Not only does it add a gain in comfort but also increases vehicle and road safety. In addition to the more obvious challenges, such as the performance of algorithms (artificial intelligence), there are also major open issues regarding hardware reliability. A computer-controlled vehicle is directly relying on the functionality of its electronic components. In completely autonomous operation, with lack of human supervision, the functional failure of electronic components becomes a central issue. That's why, a safe electronic surveillance system must take over the role of human supervision in the future. To improve the electronics' functional safety, much research has already been done in recent years. On a basic level, the on-board sensor implementation to observe the system temperature and observing the thermal management for electronic devices is a well advanced topic and has been existing for a while in the automotive industry in general. However, an "intuitive" early detection of physical defects was rarely in focus. In this paper, a defect diagnosis and physical damage detection method for electronics packaging and assembly is being presented. This process of thermal on-board spectroscopy uses intelligent temperature sensors to monitor the status of electronic assemblies and ECUs during vehicle use by analyzing the thermal impedance and the time-dependent thermal changes of the electronic packaging system.