Piezoelectric MEMS Vibration Sensor Module for Machining Quality Prediction

In this work, a piezoelectric MEMS based vibration sensor with a unique gimbal shaped guard ring in differential electrical configuration has been designed for enhanced acceleration sensitivity in out-of-plane direction and reduced in-plane crosstalk. The Thin-film Piezo on Silicon (TPoS) accelerome...

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Bibliographic Details
Published in2020 IEEE Sensors pp. 1 - 4
Main Authors Trivedi, Shyam, Ganesh, Ranjith Hosur, Shen, Tung, Huang, Po-Wen, Li, Sheng-Shian
Format Conference Proceeding
LanguageEnglish
Published IEEE 25.10.2020
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Summary:In this work, a piezoelectric MEMS based vibration sensor with a unique gimbal shaped guard ring in differential electrical configuration has been designed for enhanced acceleration sensitivity in out-of-plane direction and reduced in-plane crosstalk. The Thin-film Piezo on Silicon (TPoS) accelerometer was fabricated using a GlobalMEMS Inc. PZT platform. This method makes use of the excellent piezoelectric property of the Lead Zirconate Titanate (PZT) thin-film along with low crystal defect property of single crystal silicon, thus ensuring a good combination of sensitivity, resolution, bandwidth, reliability, and lifetime. A system-level approach was adopted to integrate the MEMS device with a charge amplifier and a microcontroller. The device performance was compared with the standard reference accelerometer for 1-g load. The developed MEMS sensor module was further implemented for surface roughness prediction in a quartz polishing system using machine learning algorithm incorporating both the acceleration-time data and the feed rate of the polishing spindle.
ISSN:2168-9229
DOI:10.1109/SENSORS47125.2020.9278649