An overview of carbon nanotubes based interconnects for microelectronic packaging

Owing to the great demand in more functions and miniaturization in microelectronic packaging, the dimensions of interconnects has decreased extremely, which has resulted in electrical, thermal, and mechanical reliability issues. To address these issues, carbon nanotube (CNT) has been selected as a p...

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Bibliographic Details
Published in2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) pp. 113 - 119
Main Authors Shujing Chen, Bo Shan, Yiqun Yang, Guangjie Yuan, Shirong Huang, Xiuzhen Lu, Yan Zhang, Yifeng Fu, Lilei Ye, Johan Liu
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.06.2017
Subjects
Bonding
CNTs based bumps
CNTs based TSVs
CNTs-Cu nanocomposite
Conductivity
Interconnect
Microelectronics
Packaging
Resistance
resistivity
Substrates
Through-silicon vias
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Summary:Owing to the great demand in more functions and miniaturization in microelectronic packaging, the dimensions of interconnects has decreased extremely, which has resulted in electrical, thermal, and mechanical reliability issues. To address these issues, carbon nanotube (CNT) has been selected as a promising alternative material for the interconnects in packaging due to its large current density, high thermal conductivity, great flexibility, and low coefficient of thermal expansion (CTE). In this paper, the development of CNTs based vertical interconnects was reviewed. However, the resistivity of CNTs based interconnects was much higher than that of copper interconnects. Thus, this review focused on the resistivity of CNTs-based interconnects in different fabrication process and pointed out what improves the resistivity. In the future, CNTs-Cu nanocomposite with unique properties could be the suitable material for bumps to reduce the resistivity of CNTs based bumps further.
DOI:10.1109/NORDPAC.2017.7993175