Statistical strength investigation of poly-silicon membranes using microscopic loading tests and numerical simulation

The strength of poly-silicon membranes was investigated by experimental tests and numerical simulations. A new fracture test has been developed that replicates the loading situation under real service conditions well but with higher stress level. A set of 45 membranes was tested at each of the three...

Full description

Saved in:
Bibliographic Details
Published in2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) pp. 1 - 6
Main Authors Brueckner, John, Auerswald, Ellen, Dudek, Rainer, Wunderle, Bernhard, Michel, Bernd, Rzepka, Sven, Dehe, Alfons
Format Conference Proceeding
LanguageEnglish
Published Circuits Multi Projets - CMP 01.04.2014
Subjects
Fracture Strength
Load modeling
Loading
Microscopy
Poly-Silicon
Strength Testing
Stress
Surface cracks
Testing
Weibull distribution
Weibull Statistics
Online AccessGet full text

Cover

More Information
Summary:The strength of poly-silicon membranes was investigated by experimental tests and numerical simulations. A new fracture test has been developed that replicates the loading situation under real service conditions well but with higher stress level. A set of 45 membranes was tested at each of the three positions on the wafer in order to assure statistical accuracy and to evaluate the strength distribution across the wafer. Using finite element simulation, fracture stresses were calculated and analyzed by means of a two-parametric Weibull distribution subsequently. High values were found for the characteristic fracture stresses. They are in the range of 5,400-6,000 MPa.
ISBN:9782355000287
235500028X
DOI:10.1109/DTIP.2014.7056632