Power QFN down bond lift and delamination study

The PQFN device revealed down bond lift and delamination issues. Based on AES (Auger Electron Spectroscopy), XPS (X-ray Photoelectron Spectroscopy) and FTIR (Fourier Transform Infrared Spectroscopy) analysis it was possible to verify that a down bond contamination caused the failure. Cross sections...

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Bibliographic Details
Published in2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) pp. 570 - 573
Main Authors Hanmin Zhang, Hu, M., Wang, Sonder, Ilko, Schmadlak, Yin, B. G., He, Q. C., Ye, D. H.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.12.2014
Subjects
Bonding
Compounds
Contamination
Delamination
Down bond lift
FEA modeling
Lead
PQFN package
Stress
Wires
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Summary:The PQFN device revealed down bond lift and delamination issues. Based on AES (Auger Electron Spectroscopy), XPS (X-ray Photoelectron Spectroscopy) and FTIR (Fourier Transform Infrared Spectroscopy) analysis it was possible to verify that a down bond contamination caused the failure. Cross sections of down bond wire for the failed unit showed a broken heel on the down bond. Furthermore, cracking between molding compound and lead frame was found. It was proven that the delamination caused the down bond lift and the broken heel. FEA (Finite Element Analysis) revealed that the delamination can lead to shear stress increase at the down bond heel.
DOI:10.1109/EPTC.2014.7028424