Integrated manufacturing of microphone-array node for wireless sensor network (WSN)

A kind of integration node with six-microphone array for wireless sensor network (WSN) using 3D-SiP technology was developed. The node includes sensing module, communication module, battery compartment and node case. Communication and sensing modules were stacked by using vertical interconnections (...

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Bibliographic Details
Published in2016 17th International Conference on Electronic Packaging Technology (ICEPT) pp. 919 - 922
Main Authors Gaowei Xu, Wei Gai, Tao Zheng, Defeng Liang, Le Luo, Juying Chen
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.08.2016
Subjects
Antennas
integration node
ISO
MEMS microphone
Micromechanical devices
Packaging
Reliability
stacked interconnection
system in package (SiP)
System integration
Vents
Wireless sensor networks
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Summary:A kind of integration node with six-microphone array for wireless sensor network (WSN) using 3D-SiP technology was developed. The node includes sensing module, communication module, battery compartment and node case. Communication and sensing modules were stacked by using vertical interconnections (including stand-off and stamp-hole) method. The sensing module contains six MEMS microphones and corresponding sound signal processing chips, master chip of signal processing, etc. On-line test result showed that the fabricated node has good performances, i.e. target recognition and classification. Vibration and shock test results showed that the integrated node has good reliability and environmental adaptability.
DOI:10.1109/ICEPT.2016.7583279