A fully integrated 2×2 b/g and 1×2 a-band MIMO WLAN SoC in 45nm CMOS for multi-radio IC

A significant increase in Smartphones and tablets with embedded Wi-Fi demands a low-cost system solution. In this paper the RF core of an 802.11n 2×2 b/g band, 2×1 a-band MIMO WLAN SoC with die area of 3.83mm 2 in 45nm CMOS is described. As shown in Fig. 19.1.1 the SoC has integrated Power Amplifier...

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Published in2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers pp. 328 - 329
Main Authors Kumar, Rakesh, Bhasin, Hemant, Agrawal, Meghna, Narayan, Subramanian, Dharwekar, Yogesh, Garg, Robin, Edayath, Vimal, Suseela, Thirunaavukkarassu, Jayaram, Vikram, Ram, Shankar, Murugan, Vidhya, Krishnaswamy, T., Kumar, Anil, Mukherjee, Subhashish, Dixit, Nagaraj, Nussbaum, Eran, Dror, Joel, Ginzburg, Nir, EvenChen, Asaf, Maruani, Asaf, Sankaran, Swaminathan, Srinivasan, Venkatesh, Rajendran, Gireesh, Rentala, Vijay, Sahu, Debapriya, Sivadas, Apu, Nandigam, Murali, Ganeshan, Saravana, Datla, Srihari, Kudari, Anand
Format Conference Proceeding
LanguageEnglish
Japanese
Published IEEE 01.02.2013
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Summary:A significant increase in Smartphones and tablets with embedded Wi-Fi demands a low-cost system solution. In this paper the RF core of an 802.11n 2×2 b/g band, 2×1 a-band MIMO WLAN SoC with die area of 3.83mm 2 in 45nm CMOS is described. As shown in Fig. 19.1.1 the SoC has integrated Power Amplifier (PA) for both bands and T/R switch in b/g band, eliminating the need for an expensive external Front-End Module. The LO is synthesized by a two-step DLL-PLL architecture to meet the stringent phase-noise requirements.
ISBN:9781467345156
1467345156
ISSN:0193-6530
2376-8606
DOI:10.1109/ISSCC.2013.6487755