Global Identification of Variability Factors and Its Application to the Statistical Worst-Case Model Generation
A novel methodology is presented to generate the worst-case model including extraction of its compact model parameters. This method enables physically accurate worst-case prediction in the early stage of device development concurrently. It is found through the intensive TEG analysis and TCAD simulat...
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Published in | 2006 International Conference on Simulation of Semiconductor Processes and Devices pp. 154 - 157 |
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Main Authors | , , , , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
01.09.2006
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Abstract | A novel methodology is presented to generate the worst-case model including extraction of its compact model parameters. This method enables physically accurate worst-case prediction in the early stage of device development concurrently. It is found through the intensive TEG analysis and TCAD simulation that correlations between process factors have a significant impact on the worst-case corner estimation. A new extraction method of compact model parameters based on error propagation analysis is developed to consider correlations between parameters |
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AbstractList | A novel methodology is presented to generate the worst-case model including extraction of its compact model parameters. This method enables physically accurate worst-case prediction in the early stage of device development concurrently. It is found through the intensive TEG analysis and TCAD simulation that correlations between process factors have a significant impact on the worst-case corner estimation. A new extraction method of compact model parameters based on error propagation analysis is developed to consider correlations between parameters |
Author | Okagaki, T. Ishikawa, K. Tanizawa, M. Tsuchiya, O. Eikyu, K. Eimori, T. |
Author_xml | – sequence: 1 givenname: K. surname: Eikyu fullname: Eikyu, K. organization: Renesas Technol. Corp., Hyogo – sequence: 2 givenname: T. surname: Okagaki fullname: Okagaki, T. organization: Renesas Technol. Corp., Hyogo – sequence: 3 givenname: M. surname: Tanizawa fullname: Tanizawa, M. organization: Renesas Technol. Corp., Hyogo – sequence: 4 givenname: K. surname: Ishikawa fullname: Ishikawa, K. organization: Renesas Technol. Corp., Hyogo – sequence: 5 givenname: T. surname: Eimori fullname: Eimori, T. organization: Renesas Technol. Corp., Hyogo – sequence: 6 givenname: O. surname: Tsuchiya fullname: Tsuchiya, O. organization: Renesas Technol. Corp., Hyogo |
BookMark | eNo9jslOAzEQRC0IEknID8DFPzDB23g5RoGEkYJACssxcjxtYWTG0diX_H1GbN2HUlU_lXqCRl3qAKFrSuaUEnO7bbbPi7s5I0TOmWZa0jM0pkbIitZKnaMJFUwIMmw9-j9Ic4lmOX-SYUQtmGJjlNYx7W3ETQtdCT44W0LqcPL4zfbB7kMM5YhX1pXUZ2y7Fjcl48XhEP_QknD5ALwtg81lSCN-H9hSLW0G_JhaiHgNHfTf-BW68DZmmP3qFL2u7l-WD9Xmad0sF5sqDH-WqjZ7YomgvLVOKcItd5RJzmqjHPWScO0BiKpb7TRY4b2RTCtmpDaOOav5FN389AYA2B368GX7404QSSUR_AQ0fF4Q |
ContentType | Conference Proceeding |
DBID | 6IE 6IL CBEJK RIE RIL |
DOI | 10.1109/SISPAD.2006.282861 |
DatabaseName | IEEE Electronic Library (IEL) Conference Proceedings IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume IEEE Xplore All Conference Proceedings IEEE Electronic Library (IEL) IEEE Proceedings Order Plans (POP All) 1998-Present |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: RIE name: IEEE Electronic Library (IEL) url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/ sourceTypes: Publisher |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering |
EISSN | 1946-1577 |
EndPage | 157 |
ExternalDocumentID | 4061604 |
Genre | orig-research |
GroupedDBID | 6IE 6IF 6IH 6IK 6IL 6IN AAJGR ABLEC ADZIZ ALMA_UNASSIGNED_HOLDINGS BEFXN BFFAM BGNUA BKEBE BPEOZ CBEJK CHZPO IEGSK IPLJI OCL RIE RIL RNS |
ID | FETCH-LOGICAL-i156t-59b0a0413dac7703a3c12632597c1f6038fee075d8c8ea4ff9628729689c2ca83 |
IEDL.DBID | RIE |
ISBN | 1424404045 9781424404049 |
ISSN | 1946-1569 |
IngestDate | Wed Jun 26 19:22:51 EDT 2024 |
IsPeerReviewed | false |
IsScholarly | true |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-i156t-59b0a0413dac7703a3c12632597c1f6038fee075d8c8ea4ff9628729689c2ca83 |
PageCount | 4 |
ParticipantIDs | ieee_primary_4061604 |
PublicationCentury | 2000 |
PublicationDate | 2006-09 |
PublicationDateYYYYMMDD | 2006-09-01 |
PublicationDate_xml | – month: 09 year: 2006 text: 2006-09 |
PublicationDecade | 2000 |
PublicationTitle | 2006 International Conference on Simulation of Semiconductor Processes and Devices |
PublicationTitleAbbrev | SISPAD |
PublicationYear | 2006 |
Publisher | IEEE |
Publisher_xml | – name: IEEE |
SSID | ssj0000454272 ssj0001286278 |
Score | 1.6640882 |
Snippet | A novel methodology is presented to generate the worst-case model including extraction of its compact model parameters. This method enables physically accurate... |
SourceID | ieee |
SourceType | Publisher |
StartPage | 154 |
SubjectTerms | Analytical models Error analysis FETs Mass production Parameter extraction Phase measurement Predictive models Random access memory Semiconductor device modeling Semiconductor process modeling |
Title | Global Identification of Variability Factors and Its Application to the Statistical Worst-Case Model Generation |
URI | https://ieeexplore.ieee.org/document/4061604 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV07T8MwELZKJ1h4tIi3PDDi1nk59lgVqhYJVKkUulWOY0sIlCBIB_j1nO2kRYiBLYmcKLYs3313932H0KWQoaFUa2LigBOrwEVkmmYkYikYs1zBa65A9p6N5_HtIlm00NWaC6O1dsVnumcvXS4_L9XKhsr61vgwK_65lQrhuVrreIqVkgtrDqiPr4Cv7g5igOmMAEwRDa8L9m2cNHJP9b1oCDVU9GeT2XRw7RMVFpE4Ae1N6xVneUa76K75Z19w8tJbVVlPff2Sc_zvpPZQd8Pxw9O19dpHLV0coJ0f8oQdVPqGANiTeU0d3cOlwY-AsL3A9yce-Y49WBY5nlQfeLBJieOqxOBgYuvROkFo-NgTjK3IEIwntn3YXrEXvrbDu2g-unkYjkndoIE8w3pWJBEZlRTMYC5VCkeHjFRg9d8BpKjAMBpxozX4JDlXXMvYGMEAoIWCcaFCJXl0iNpFWegjhDPwfKJUC84Yj7NE8jiIlQw4M1TROMqPUccu3fLNa3As61U7-fvxKdr2oRJbC3aG2tX7Sp-D81BlF27XfAOcDbvz |
link.rule.ids | 310,311,783,787,792,793,799,27939,55088 |
linkProvider | IEEE |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1NT8IwGG4IHtSLH2D8tgePFvbZtUeCElAgJIByI13XJkazGR0H_fW-XTcwxoO3bemWtWn6Pu_H87wIXXPhacdRiujAZcQocBERRTHxaQTGLJHwWlEgO6b9eXC_CBc1dLPmwiiliuIz1TKXRS4_yeTKhMraxvhQI_65FRpcYdla64iKEZPzShaojbAAWi-OYnDUKQFHhVfMLti5QVgJPpX3vKLUOLw9HUwnnVubqjA-SSGhvWm-Utie3h4aVX9tS05eWqs8bsmvX4KO_53WPmpuWH54srZfB6im0kO0-0OgsIEy2xIAWzqvLuN7ONP4EXxsK_H9iXu2Zw8WaYIH-QfubJLiOM8wQExsMG0hCQ0fe4KxOemC-cSmE9srttLXZngTzXt3s26flC0ayDOsZ05CHjvCAUOYCBnB4SF86RoFeHBTpKup4zOtFKCShEmmRKA1p-CieZwyLj0pmH-E6mmWqmOEY8A-fqQ4o5QFcShY4AZSuIxqRzqBn5yghlm65ZtV4ViWq3b69-MrtN2fjYbL4WD8cIZ2bODEVIado3r-vlIXACXy-LLYQd-oSr9A |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=proceeding&rft.title=2006+International+Conference+on+Simulation+of+Semiconductor+Processes+and+Devices&rft.atitle=Global+Identification+of+Variability+Factors+and+Its+Application+to+the+Statistical+Worst-Case+Model+Generation&rft.au=Eikyu%2C+K.&rft.au=Okagaki%2C+T.&rft.au=Tanizawa%2C+M.&rft.au=Ishikawa%2C+K.&rft.date=2006-09-01&rft.pub=IEEE&rft.isbn=9781424404049&rft.issn=1946-1569&rft.eissn=1946-1577&rft.spage=154&rft.epage=157&rft_id=info:doi/10.1109%2FSISPAD.2006.282861&rft.externalDocID=4061604 |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1946-1569&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1946-1569&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1946-1569&client=summon |