Tc depression and superconductor-insulator transition in molybdenum nitride thin films

• Published in: Journal of physics. Conference series Vol. 969; no. 1
• Main Authors: Ichikawa, F, Makise, K, Tsuneoka, T, Maeda, S, Shinozaki, B
• Format: Journal Article
• Language: English
• Published: Bristol IOP Publishing 01.03.2018
• Subjects: Elastic scattering; Electrical resistivity; Magnetron sputtering; Mirrors; Molybdenum; Niobium nitride; Physics; Substrates; Thick films; Thin films; Transition temperature
• ISSN: 1742-6588; 1742-6596
• DOI: 10.1088/1742-6596/969/1/012064

We have studied that the Tc depression and the superconductor-insulator transition (SIT) in molybdenum nitride (MoN) thin films. Thin films were fabricated by reactive DC magnetron sputtering method onto (100) MgO substrates in the mixture of Ar and N2 gases. Several dozen MoN thin films were prepared in the range of 3 nm < thickness d < 60 nm. The resistance was measured by a DC four-probe technique. It is found that Tc decreases from 6.6 K for thick films with increase of the normal state sheet resistance RsqN and experimental data were fitted to the Finkel'stein formula using the bulk superconducting transition temperature Tc0 = 6.45 K and the elastic scattering time of electron τ = 1.6 × 10−16 s. From this analysis the critical sheet resistance Rc is found about 2 kΩ, which is smaller than the quantum sheet resistance RQ. This value of Rc is almost the same as those for 2D NbN films. The value of τ for MoN films is also the similar value for NbN films 1.0 × 10−16 s, while Tc0 is different from that for NbN films 14.85 K. It is indicated that the mechanism of SIT for MoN films is similar to that of NbN films, while the mean free path ℓ for MoN films is larger than that for NbN films.