Measuring the span of stress asymmetries on high-precision matched devices

This paper discusses test structures and measurements to answer the question of how far mixed-signal circuit designers (and test structure designers) should keep layout asymmetries away from matched device constructions. Test structures for assessing the span of mechanical stress asymmetries on matc...

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Bibliographic Details
Published inProceedings of the 2004 International Conference on Microelectronic Test Structures (IEEE Cat. No.04CH37516) pp. 117 - 122
Main Authors Tuinhout, H.P., Bretveld, A., Peters, W.C.M.
Format Conference Proceeding
LanguageEnglish
Published Piscataway NJ IEEE 2004
Subjects
Applied sciences
Circuit testing
Consumer electronics
Electronic equipment testing
Electronics
Exact sciences and technology
Integrated circuit measurements
Microelectronics
Mirrors
Resistors
Semiconductor device testing
Stress measurement
Surfaces
Testing, measurement, noise and reliability
Testing equipment
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Summary:This paper discusses test structures and measurements to answer the question of how far mixed-signal circuit designers (and test structure designers) should keep layout asymmetries away from matched device constructions. Test structures for assessing the span of mechanical stress asymmetries on matched device constructions were designed, fabricated and characterised. The obtained results can be extremely important for small signal analogue electronic circuit designers.
ISBN:9780780382626
0780382625
DOI:10.1109/ICMTS.2004.1309463