Temperature sensor placement including routing overhead and sampling inaccuracies

Dynamic thermal management techniques require a collection of on-chip thermal sensors that imply a significant area and power overhead. Finding the optimum number of temperature monitors and their location on the chip surface to optimize accuracy is an NP-hard problem. In this work we improve the mo...

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Bibliographic Details
Published in2012 International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) pp. 69 - 72
Main Authors Ituero, P., Garcia-Redondo, F., Lopez-Vallejo, M.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.09.2012
Subjects
Accuracy
Monitoring
Resource management
Temperature measurement
Temperature sensors
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Summary:Dynamic thermal management techniques require a collection of on-chip thermal sensors that imply a significant area and power overhead. Finding the optimum number of temperature monitors and their location on the chip surface to optimize accuracy is an NP-hard problem. In this work we improve the modeling of the problem by including area, power and networking constraints along with the consideration of three inaccuracy terms: spatial errors, sampling rate errors and monitor-inherent errors. The problem is solved by the simulated annealing algorithm. We apply the algorithm to a test case employing three different types of monitors to highlight the importance of the different metrics. Finally we present a case study of the Alpha 21364 processor under two different constraint scenarios.
ISBN:9781467306850
1467306851
DOI:10.1109/SMACD.2012.6339419