FOWLP AiP for SOTM Applications

This paper presents a wideband dual-polarized Antenna-in-Package (AiP) element implemented in Fan-Out Wafer-Level-Packaging (FOWLP) technology for SATCOM On the Move (SOTM) beam steering applications. The AiP element features a meta-surface radiator and two sets of orthogonally arranged power divide...

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Bibliographic Details
Published in2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) pp. 353 - 357
Main Authors Mei, Sun, Guan, Lim Teck, Yong, Han
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.05.2022
Subjects
Antenna-in-Package
Apertures
Beam steering
FOWLP
Meta-surface
Phased arrays
Power dividers
Product development
SOTM
Stacking
Temperature distribution
Wafer Level Packaging
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Summary:This paper presents a wideband dual-polarized Antenna-in-Package (AiP) element implemented in Fan-Out Wafer-Level-Packaging (FOWLP) technology for SATCOM On the Move (SOTM) beam steering applications. The AiP element features a meta-surface radiator and two sets of orthogonally arranged power divider aperture feed to achieve wideband performance and pure dual polarizations. By stacking a top mold of 300μm, a middle mold of 90μm and a 42μm RDL layer at the bottom, with a size of 6mm×6mm×0.442mm the AiP element achieves a Return Loss > 13.4dB, an Isolation > 20.6 dB, a Gain of 5.54-6.78dBi over the 27-31 GHz with pure H and V polarizations. The concept of circular polarized 2×2 AiP subarray with an embedded 8-channel beamformer chip and the method of further forming the scalable array are illustrated. The AiP thermal dissipation is also evaluated.
ISSN:2377-5726
DOI:10.1109/ECTC51906.2022.00065