Measuring Seebeck coefficient on thin film thermoelectric materials without metallization treatment

This paper developed a new methodology which is a sandwich-like platform to measure Seebeck coefficient for single layer thin-film thermoelectric devices which are flexible and wearable without environmental limitation. With our new apparatus, a stably controlled temperature gradient environment is...

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Bibliographic Details
Published in2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) pp. 315 - 318
Main Authors Yao-Shing Chen, Shih-Jue Lin, Ben-Je Lwo
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.10.2015
Subjects
Bridge circuits
Semiconductor device measurement
Substrates
Temperature control
Temperature distribution
Temperature measurement
Thermoelectric devices
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Summary:This paper developed a new methodology which is a sandwich-like platform to measure Seebeck coefficient for single layer thin-film thermoelectric devices which are flexible and wearable without environmental limitation. With our new apparatus, a stably controlled temperature gradient environment is created on thin-film test samples so that the commonly used and simple probing can be employed for Seebeck coefficient measurements. This paper finally verified the accuracy and availability of the new experimental design through Seebeck coefficient measurements on a typical organic conductive material (PEDOT).
ISBN:9781467396905
1467396907
DOI:10.1109/IMPACT.2015.7365204